Effects of Copper (II) Albumin Complex on Thermal Skin Burn

Document Type : Original Article

Authors

1 Department of Medical Biochemistry, Faculty of Medicine, Assiut University, Assiut, Egypt

2 Department Histology, Faculty of Medicine, Assiut University, Assiut, Egypt

3 Department of Medical Biochemistry , Faculty of Medicine, Assiut University, Assiut, Egypt

Abstract

Background: Thermal burn results in release of many chemical mediators such as
free radicals, biogenic amines and neurotransmitters. The modulations of these
mediators can enhance burn wound healing.
Aim of the Work: To evaluate effects of copper (II) albumin complex on thermal
wound healing.
Materials and Methods: An animal model of 190 Sprague Dawely rats was
established. Ten rats served as a control group and 180 rats were exposed to 10%
total body surface area full thickness thermal burn. The rats were equally divided
into three groups and treated topically either with soft paraffin, moist exposed burn
ointment (MEBO), or with copper (II) albumin complex. At 4 hours, first day, third
day, first week, second week and third week post-injury, plasma was used for
determination of malondialdehyde (MDA), total antioxidant capacity (TAC), 5-
hydroxy tryptamine (5-HT) and gamma amino butyric acid (GABA). Skin tissues were
taken for histopathological examination with light microscopy.
Results: Thermal injury resulted in a significant increase of plasma levels of MDA, 5-
HT and GABA and a significant decrease of TAC. The treated groups with copper (II)
albumin complex and MEBO showed a significant decrease of plasma levels of MDA
and 5-HT and a significant increase of plasma levels of TAC. Copper (II) albumin
complex treatment was associated with a significant increase of plasma levels of
GABA at the first and third day post-burn as compared to the other treated groups.
Characteristic enhancement of regeneration of epidermis and hair follicles was
observed following application of copper (II) albumin complex.
Conclusions: The topical application of copper (II) albumin complex was associated
with improved healing signs of full thickness thermal burn due to its antioxidant, antiinflammatory
and pain modulating effects.

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